JYY Automation Technologies Private Limited

1. Based on the reliability of the basic structure of the high-speed machine
2. Protection components of the mount
3.0.25 seconds / CHIP high-speed mounting
4 can be mounted 0.5 feet spacing 32mm QFP
5. High-speed image processing
6.2 cameras reduce production time
7. Newly designed high rigidity frame
8. Increase the speed of the shaft
9. Can handle a variety of components
10. The most suitable for computer SIMM production with 8 wired head
Substrate size: L600 * W400 (Max) / L50 * W50 (Min)
Substrate thickness 0.4-3.0
Substrate conveying direction right - left
Mounting accuracy ± 0.1mm / CHIP ± 0.08 / QFP
Mounting Speed 0.25 sec / CHIP 1.7 sec / QFP
Original Type Ribbon original: 100 (MAX, 8MM with conversion)
Tray Original: 80 kinds (TMAX, YTF use)
The original form of supply 8-56mm broadband, rod, bulk, tray
Placement Original 1005 ~ QFP''''''''SQP''''''''SOJ''''''''PLCC (25mm) BGA (0.4p)
Power three-phase AC220 / 208/230/240/380/400 / 416V ± 10%, 50 / 60HZ
Power 4KVA
Pressure above 0.55MPA, 350MIN
Dimensions L1650 * W1350 * H1810
Weight 1300KG
Patch speed 10000 (grain / hour)
Weight 1300 (kg)